Analyzing The U.S. Advanced Packaging Ecosystem With ...

Researchers from the University of Florida, University of Miami, and Skywater Technology Foundry have published a technical paper titled "US Microelectronics Packaging Ecosystem: Challenges and Opportunities." The paper discusses the shift from traditional methods in the semiconductor industry and the potential of Heterogeneous Integration (HI) through advanced packaging techniques. It also highlights the need for research and development of advanced packaging to address security threats. Efforts are being made to bring semiconductor fabrication facilities onshore in the US to ensure a secure supply chain. The paper identifies bottlenecks and weak links in the US advanced packaging supply chain.

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